Job description

onsemi is seeking a self-driven and motivated packaging modeling and simulation engineer to join their Corporate R&D modeling and simulation team in (Sunnyvale, CA). As a semiconductor packaging modeling and simulation engineer, you will have the opportunity to build the Ecosystem for system-level simulation that includes design optimization and probability for our virtual prototyping platform and support new package development and new product design, assembly, and process, quality and reliability, and customer's system in worldwide. This Eco platform can allow for the multiscale and multi-physics from the device, packaging, and PCB to the system.

This opportunity will ask a candidate to have the following performance objectives:

• Be able to do thermal-mechanical stress simulation for microelectronic package

• Learn the ANSYS data management software Minerva for building the simulation Data management system for global simulation team at onsemi

• Investigate and test all possibilities of the software Minerva and apply the optimization methods to Thermo-mechanical stress in package design, reliability, and assembly process.

• Setup and maintain the HW/SW environment for the thermal and mechanical simulation through Minerva

• Work in an interface with software vendor ANSYS and onsemi internal teams to debug the issues of the Minerva system in both Window/Linux setups and integration of Jira and other software such as Flotherm

• Build the Eco simulation platform through ANSYS Minerva, material database and integrate with other software into the Ecosystem.

Qualifications

• PhD or Master degree candidate in Physics, EE, Mechanical Engineering/Mechanics Computational Mechanics, or Materials

• Knowledge and experience on thermo-mechanical modeling

• Knowledge and experience of CAD concepts such as Solidworks

• Knowledge and experience of thermal and mech simulation, optimization/probability analysis through ANSYS

• Knowledge semiconductor/microelectronic packaging

• Familiar with material thermo-mechanical properties

• Strong knowledge of problem analysis and diagnosis technique

• Ability to perform model correlation to empirical measurement

• Familiar with the Unix/Linux operating system

• Familiar with FEA software ANSYS, familiar with ANSYS Minerva is plus

• Strong English communication capability

• Strong learning capability

• Good team player

Job Type: Full-time

Pay: $103,500.00 - $140,000.00 per year

Benefits:

• 401(k)
• 401(k) matching
• Dental insurance
• Employee assistance program
• Employee discount
• Flexible spending account
• Health insurance
• Health savings account
• Life insurance
• Paid time off
• Parental leave
• Professional development assistance
• Referral program
• Relocation assistance
• Retirement plan
• Tuition reimbursement
• Vision insurance

Experience level:

• 1 year
• 2 years

Schedule:

• 8 hour shift
• Monday to Friday

Work setting:

• In-person

Experience:

• CAD concepts such as Solidworks: 2 years (Required)
• optimization/probability analysis through ANSYS: 2 years (Required)
• semiconductor/microelectronic packaging: 1 year (Required)

Work Location: In person

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